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Polymer Materials

POSS (Polyhedral Oligomeric Silsesquioxanes)

Cas No. 69655-76-1 POSS C16H24O12Si8
photocurable click reaction

Cas No. 69655-76-1

Packing: 10kg

  • Octavinyl-T8-silsesquioxane
  • C16H24O12Si8
  • 633.04 g/mol
  • White powder
  • It can copolymerize with polymers containing double bonds;
  • It can be used as a vinyl monomer in click reactions;
  • It can be used as a heat-resistant and ablation-resistant filler;
  • It can be used in photocurable material

POSS C54H52O14Si10
photocurable click reaction

Cas No. N/A

Packing: 10kg

  • Divinyl DDSQ
  • C54H52O14Si10
  • 1205.85 g/mol
  • White powder
  • It can copolymerize with polymers containing double bonds;
  • It can be used as a vinyl monomer in click reactions;
  • It can be used as a heat-resistant and ablation-resistant filler;
  • It can be used in photocurable materials.

POSS C54​H62​O12​Si10
photocurable click reaction

Cas No. N/A

Packing: 10kg

  • Trivinyl POSS
  • C54​H62​O12​Si10
  • 1183.93 g/mol
  • White powder
  • It can copolymerize with polymers containing double bonds;
  • It can be used as a vinyl monomer in click reactions;
  • It can be used as a heat-resistant and ablation-resistant filler;
  • It can be used in photocurable materials.

POSS C64H76O14Si12
photocurable click reaction

Cas No. N/A

Packing: 5kg

  • Tetravinyl DDSQ
  • C64H76O14Si12
  • 1406.32 g/mol
  • White powder
  • It can copolymerize with polymers containing double bonds;
  • It can be used as a vinyl monomer in click reactions;
  • It can be used as a heat-resistant and ablation-resistant filler;
  • It can be used in photocurable materials.

POSS C64H76O14Si12
photocurable click reaction

Cas No. N/A

Packing: 5kg

  • Octylpropyloxypropyl POSS
  • C57H90O28Si8
  • 1448.00 g/mol
  • Colorless liquid
  • Used in the preparation of high-temperature photocurable materials;
  • Used in high-resolution photoresists;
  • Used in high-strength, high-toughness, low-dielectric resins;
  • As a dispersant and solubilizer for nano-silica;
  • Can be used as a cosmetic additive, providing moisturizing, anti-wrinkle, and UV protection effects.

POSS C49H46O14Si8
photocurable click reaction

Cas No. N/A

Packing: 5kg

  • Monomethylpropyl-oxypropyl POSS
  • C49H46O14Si8
  • 1083.57 g/mol
  • White powder
  • It can be used as a vinyl comonomer;
  • It can be used as a heat-resistant and ablation-resistant filler;
  • It can be used in photocurable materials.

photocurable POSS click reaction

Cas No. N/A

Packing: 5kg

  • Tetraborneol POSS
  • White powder
  • Can be co-cured with resins containing double bonds; 
  • Can be used as a heat-resistant and ablation-resistant filler.

DDSQ POSS photocurable click reaction

Cas No. N/A

Packing: 5kg

  • Dinorbornene DDSQ
  • White powder
  • Can be co-cured with resins containing double bonds; 
  • Can be used as a heat-resistant and ablation-resistant filler.

POSS Cas No. 164017-77-0  C48H88O28Si8 Resin reinforcing agents, dispersants, and cosolvents

Cas No. 164017-77-0

Packing: 10kg

  • Octaglycidyl ether epoxy POSS
  • C48H88O28Si8
  • 1337.88 g/mol
  • Colorless liquid
  • It has excellent toughening and reinforcing effects on epoxy and bismaleimide resins;
  • It can be used as a dispersant or cosolvent for powder materials such as carbon nanotubes and nano-silica;
  • It can be used as a cosmetic diluent and antioxidant, and has excellent adhesion to collagen and kerati

POSS, DDSQ, C62H68O18Si10 Resin reinforcing agents

Cas No. N/A

Packing: 10kg

  • Diglycidyl ether glycidyl-DDSQ
  • C62H68O18Si10
  • 1382.06 g/mol
  • White powder
  • It has excellent toughening and reinforcing effects on epoxy and bismaleimide resins;
  • It can be used as a temperature-resistant and ablation-resistant modifier.

Cas No. 187333-74-0
C64H104O20Si8
Resin reinforcing agents, dispersants, and cosolvents

Cas No. 187333-74-0

Packing: 5kg

  • Octacyclohexylepoxy POSS
  • C64H104O20Si8
  • 1418.20 g/mol
  • Colorless liquid
  • It can be used as a dielectric modifier for epoxy, bismaleimide, and cyanate ester resins;
  • It has excellent toughening and reinforcing effects on epoxy and bismaleimide resins;
  • It can be used as a dispersant or co-solvent for powder materials such as carbon nanotubes and nano-silica.

POSS Cas No. 677752-26-0
C16H32Cl8O12Si8
Used for ATRP star-shaped polymers; a flame retardant

Cas No. 677752-26-0

Packing: 5kg

  • Octachloropropyl POSS
  • C16H32Cl8O12Si8
  • 924.73 g/mol
  • White powder
  • It can be used as an initiator for ATRP polymerization to synthesize star-shaped polymers;
  • It can be used as a flame retardant for polymer materials;
  • It can be used as an intermediate to derive other POSS materials.

POSS Cas No. 161678-48-4
C24H56O12S8Si8 
Used for ATRP star-shaped polymers; a flame retardant

Cas No. 161678-48-4

Packing: 5kg

  • Octapercaptopropyl POSS
  • C24H56O12S8Si8
  • 1017.90 g/mol
  • Colorless liquid
  • It can be used as an initiator for ATRP polymerization to synthesize star-shaped polymers;
  • It can be used as a flame retardant for polymer materials;
  • It can be used as an intermediate to derive other POSS materials.

POSS DDSQ C48H40Na4O14Si8
As an inorganic filler, it improves the temperature resistance of material

Cas No. N/A

Packing: 5kg

  • Sodium tetrasilyl alcohol DDSQ
  • C48H40Na4O14Si8
  • 1157.47 g/mol
  • White powder
  • As an inorganic filler, it improves the temperature resistance of materials;
  • It can also be used as a precursor to synthesize POSS hybrid materials with other functionalities.

POSS DDSQ C50H48O14Si10 crosslinking, high-temperature resistant inorganic filler.

Cas No. N/A

Packing: 5kg

  • Dihydro DDSQ
  • C50H48O14Si10
  • 1153.77 g/mol
  • White powder
  • It can be used as a crosslinking agent for silicone resins;
  • It can be used as a high-temperature resistant inorganic filler.

POSS DDSQ  674298-98-7 C56H68O14Si12 crosslinking agent for silicone; high-temperature resistant

Cas No. 674298-98-7

Packing: 5kg

  • Tetrahydro DDSQ
  • C56H68O14Si12
  • 1302.17 g/mol
  • White powder
  • It can be used as a crosslinking agent for silicone resins;
  • It can be used as a high-temperature resistant inorganic filler.

If you have any questions or suggestions about the product, please send an email to 'info@essenoichemical.com'.

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